| Product Name: Halocarbon C318 – Octafluorocyclobutane C4F8 |
| Packing: 40L, 44L, 47L, 50L cylinder (GB, ISO, DOT) |
| Filling Content: 40kg/cyl |
| Items |
Specifications |
| C4F8 |
99.9% |
99.999% |
| O2 |
≤80 ppmv |
≤1.0 ppmv |
| N2 |
≤300 ppmv |
≤3.0 ppmv |
| CO2 |
≤50ppmv |
≤0.5ppmv |
| CO |
≤30 ppmv |
≤0.5 ppmv |
| CH4 |
≤30 ppmv |
≤0.5 ppmv |
| H2O |
≤10 ppmv |
≤3.0 ppmv |
| Other Organics |
≤600 ppmv |
≤5.0 ppmv |
| Acidity as HCL |
≤1.0 ppmw |
≤0.1 ppmw |
|
| Transportation |
| DOT Shipping Name |
Octafluorocyclobutane |
| DOT Classification |
2.2 |
| DOT Label |
Nonflammable Gas |
| UN Number |
UN 1976 |
| CAS No. |
115-25-3 |
| CGA/DISS/JIS |
660/716/W22-14L |
| Shipped as |
Liquefield Gas |
|
| Technical Information |
| Cylinder State @ 21.1°C |
Liquid |
| Flammable Limits In Air |
Non-flammable |
| Auto Ignition Temperature (°C ) |
– |
| Molecular Weight (g/mol) |
200.03 |
| Specific gravity (air =1) |
7.33 |
| Critical Temperature ( °C ) |
115.2 |
|
| Applications |
| Perfluorocyclobutane (C4F8) is used in semiconductor manufacturing as plasma etching of silicon dioxide (SiO2) or silicon layers. |
